| Title : Evaluation of cellulose-binding domain fused to a lipase for the lipase immobilization - Hwang_2004_Biotechnol.Lett_26_603 |
| Author(s) : Hwang S , Ahn J , Lee S , Lee TG , Haam S , Lee K , Ahn IS , Jung JK |
| Ref : Biotechnol Lett , 26 :603 , 2004 |
| Abstract : |
| PubMedSearch : Hwang_2004_Biotechnol.Lett_26_603 |
| PubMedID: 15168862 |
| Title : Evaluation of cellulose-binding domain fused to a lipase for the lipase immobilization - Hwang_2004_Biotechnol.Lett_26_603 |
| Author(s) : Hwang S , Ahn J , Lee S , Lee TG , Haam S , Lee K , Ahn IS , Jung JK |
| Ref : Biotechnol Lett , 26 :603 , 2004 |
| Abstract : |
| PubMedSearch : Hwang_2004_Biotechnol.Lett_26_603 |
| PubMedID: 15168862 |
| Title : Evaluation of cellulose-binding domain fused to a lipase for the lipase immobilization - Hwang_2004_Biotechnol.Lett_26_603 |
| Author(s) : Hwang S , Ahn J , Lee S , Lee TG , Haam S , Lee K , Ahn IS , Jung JK |
| Ref : Biotechnol Lett , 26 :603 , 2004 |
| Abstract : |
| PubMedSearch : Hwang_2004_Biotechnol.Lett_26_603 |
| PubMedID: 15168862 |
| Title : Overexpression of an alkaline lipase gene from Proteus vulgaris K80 in Escherichia coli BL21\/pKLE - Lee_2000_Biotechnol.Lett_22_1543 |
| Author(s) : Lee HW , Yoon SJ , Kim HK , Park KM , Oh TK , Jung JK |
| Ref : Biotechnol Lett , 22 :1543 , 2000 |
| Abstract : |
| PubMedSearch : Lee_2000_Biotechnol.Lett_22_1543 |
| PubMedID: |
| Title : Overexpression of an alkaline lipase gene from Proteus vulgaris K80 in Escherichia coli BL21\/pKLE - Lee_2000_Biotechnol.Lett_22_1543 |
| Author(s) : Lee HW , Yoon SJ , Kim HK , Park KM , Oh TK , Jung JK |
| Ref : Biotechnol Lett , 22 :1543 , 2000 |
| Abstract : |
| PubMedSearch : Lee_2000_Biotechnol.Lett_22_1543 |
| PubMedID: |
| Title : Overexpression of an alkaline lipase gene from Proteus vulgaris K80 in Escherichia coli BL21\/pKLE - Lee_2000_Biotechnol.Lett_22_1543 |
| Author(s) : Lee HW , Yoon SJ , Kim HK , Park KM , Oh TK , Jung JK |
| Ref : Biotechnol Lett , 22 :1543 , 2000 |
| Abstract : |
| PubMedSearch : Lee_2000_Biotechnol.Lett_22_1543 |
| PubMedID: |